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Multistrata Subsurface Laser-Modified Microstructure With Backgrind-Assisted Controlled Fracture for Defect-Free Ultrathin Die Fabrication.

DOI

10.1109/TCPMT.2015.2435369

Publication Type

Citation

Multistrata Subsurface Laser-Modified Microstructure With Backgrind-Assisted Controlled Fracture for Defect-Free Ultrathin Die Fabrication." Teh, Weng-Hong, Duane S. Boning and Roy Welsch. IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 5, No. 7 (2015): 1006-1018.